The Automation Evolution of Semiconductor Smart Manufacturing

As semiconductor manufacturing moves towards 2nm and below, the demand for precision, efficiency, and environmental adaptability has significantly increased. Traditional automation systems struggle with dynamic compensation, multi-device coordination, and cleanroom compatibility—creating a growing need for next-generation intelligent solutions.

Technological Breakthroughs

1. High-Precision Dynamic Compensation

   Through multi-sensor fusion and real-time control algorithms, the new generation of automation systems achieves sub-micron (±0.05mm) positioning accuracy, meeting the stringent wafer handling requirements of advanced processes.

2. Integrated System Design

   Deep integration of robotic arms, AMRs, and visual systems simplifies deployment and reduces debugging time by 90%, addressing coordination complexity across multiple brands.

3. Cleanroom Optimization

   Certified to Class 1 cleanroom standards, the equipment features outstanding low-particle emissions and electromagnetic compatibility (EMC), ensuring stable and safe production environments.

Project Achievements

• Over 20% improvement in Overall Equipment Effectiveness (OEE)
• Wafer breakage rate reduced to below 0.001ppm
• Production line expansion cycle shortened from weeks to days