Smartnoble Wet Cleaning Solution: Precision Cleaning for Demanding Microfabrication Needs

In advanced microfabrication and infrared (IR) device production, surface cleanliness is critical to yield and reliability. Smartnoble's state-of-the-art Wet Cleaning System is purpose-built for removing organic residues, metal ions, and particulate contamination at micron and submicron levels—especially in complex semiconductor and optoelectronic packaging processes.
This equipment is ideal for applications in InSb wafer processing, MCT (HgCdTe/InGaSb) device manufacturing, Dewar assembly, and other clean-critical stages. Engineered to support both automatic immersion cleaning and manual cleaning operations, it ensures exceptional flexibility and process control across high-value substrates and precision components.

Key Features & Technical Highlights

• Dual Configuration: Automatic & Manual Cleaning Modules

1. Automatic module supports photoresist removal, etching, and post-exposure development
2. Manual module integrates spray, bubbling, ultrasonic agitation, and substrate oscillation for enhanced cleaning of complex geometries
3. Modular design supports 6-inch and 8-inch wafers or carriers, with customizable layout options

• Smart Process Control

1. Real-time monitoring of chemical concentrations, dosing, rinse water levels, and tank conditions
2. Automated control of temperature, timing, and fluid exchange
3. Compatible with industrial Ethernet and IIoT platforms for seamless integration with smart factory systems

• Certified Cleanroom Compatibility & Reliability

1. Designed for Class 100–1,000 cleanroom environments
2. ESD-safe, corrosion-resistant structure, with high system uptime and low maintenance needs
3. Fully compliant with international manufacturing standards (e.g., ISO, IATF)