Smartnoble High-Precision Fully Automatic Wafer Edge Chamfering Machine

                                          
The Smartnoble Automatic Wafer Edge Chamfering Machine is a high-precision processing solution designed specifically for the wafer fabrication stage in the semiconductor industry. It accurately shapes non-circular or rough-edged wafers into standard circular wafers while performing precise edge chamfering. This equipment plays a critical role in enhancing wafer yield and ensuring production safety.
The system combines a high-speed grinding wheel with a precision motion control platform to deliver efficient and uniform edge chamfering. Wafers are placed on a rotary stage, where grinding is applied under real-time monitored pressure and distance, enabling adaptive processing for wafers of various materials and conditions.
This machine is ideal for wafer processing, IC pre-packaging, and wafer reconstruction—especially for fragile substrates such as SiC and GaN.

Key Features

• Supports wafer diameters up to 120mm, ideal for mainstream wafer sizes.
• Handles wafer thickness from 0.7 to 1.1mm, compatible with various materials including SiC and GaN.
• Equipped with a high-speed grinding wheel running at up to 6000 rpm for balanced efficiency and precision.
• Achieves chamfer width tolerance of ±50 μm and diameter precision of ±30 μm.
• Uses precision drive platform and rotary worktable to ensure full 360° uniform chamfering.
• Fully automated wafer input/output, compatible with in-line production systems.

Smartnoble continues to empower semiconductor manufacturers with precision, reliability, and efficiency—maximizing production yield and minimizing process variability.
Contact Us:www.smartnoble.com